- Manufacturer：
-
- Aavid (17)
- Comair Rotron (2)
- CUI Devices (2)
- Wakefield-Vette (5)
- Part Status：
-
- Material：
-
- Packaging：
-
- Length：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
42 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 26... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 22... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK DPAK SM... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
559
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Aavid | TOP MOUNT HEATSI... |
622
In-stock
|
|||
|
|
Aavid | HEATSINK D-PAK3 T... |
5,612
In-stock
|
|||
|
|
Aavid | HEATSINK D-PAK3 T... |
5,612
In-stock
|
|||
|
|
Aavid | HEATSINK D-PAK3 T... |
5,500
In-stock
|