- Manufacturer：
-
- Comair Rotron (1)
- Ohmite (2)
- Wakefield-Vette (1)
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Material Finish：
-
4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK FOR TO-1... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 35MM... |
920
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-1... |
55
In-stock
|