- Manufacturer:
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- CUI Devices (1)
- Package Cooled:
-
- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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3 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|