Manufacturer:
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Image Part Manufacturer Description Stock Action
7-1542004-3 TE Connectivity
HEAT SINK BGA 21MM...
5,000
In-stock
5-1542004-4 TE Connectivity
HEAT SINK BGA 21MM...
22
In-stock
578622B03200G Aavid
HEATSINK TO-220 DU...
5,775
In-stock
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