- Manufacturer：
-
- Aavid (1)
- CUI Devices (1)
- Ohmite (4)
- Wakefield-Vette (1)
- Material：
-
- Package Cooled：
-
- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
250
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
2,600
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1,250
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
17,000
In-stock
|