- Manufacturer:
-
- Aavid (5)
- CUI Devices (3)
- Ohmite (14)
- Wakefield-Vette (4)
- Material:
-
- Length:
-
- Width:
-
- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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29 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
![]() |
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
![]() |
Ohmite | HEATSINK D2PAK TO... |
5,000
In-stock
|
|||
![]() |
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
|||
![]() |
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
![]() |
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
![]() |
Ohmite | HEATSINK D2PAK TO... |
5,000
In-stock
|
|||
![]() |
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
![]() |
Ohmite | TO-263 HEAT SINK / P... |
250
In-stock
|
|||
![]() |
Wakefield-Vette | TO-268 HEAT SINK AN... |
750
In-stock
|
|||
![]() |
Aavid | HEATSINK D-PAK3 T... |
5,500
In-stock
|
|||
![]() |
Ohmite | HEATSINK FOR TO-2... |
9,400
In-stock
|
|||
![]() |
Wakefield-Vette | TO-263 HEAT SINK AN... |
1,250
In-stock
|
|||
![]() |
Ohmite | HEATSINK FOR TO-2... |
1,000
In-stock
|