- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (3)
- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X14.5M... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
78
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 21X15MM D... |
98
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 21X15MM S... |
100
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 21X15MM F... |
100
In-stock
|