Series:
Material:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description Stock Action
ATS-PCB1061 Advanced Thermal Solutions, Inc.
HEATSINK TRIPLE ...
1,349
In-stock
HSS-B20-095H CUI Devices
HEATSINK TO-220 4.1W...
482
In-stock
1 / 1 Page, 2 Records