- Manufacturer：
-
- Comair Rotron (2)
- Wakefield-Vette (3)
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 17... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 25... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|