- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (1)
- Part Status：
-
- Type：
-
- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK HALF BR... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 21X21X23MM... |
5,000
In-stock
|