- Manufacturer:
-
- Sanyo Denki (7)
- Seeed (1)
- TE Connectivity (11)
- Wakefield-Vette (59)
- Series:
-
- Part Status:
-
- Shape:
-
- Length:
-
- Width:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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118 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Sanyo Denki | P4,CELERON,1.7-3.2GH... |
5,000
In-stock
|
|||
![]() |
Sanyo Denki | P4,CELERON,1.7-2.8GH... |
5,000
In-stock
|
|||
![]() |
Sanyo Denki | P4,CELERON,1.7-2.8GH... |
5,000
In-stock
|
|||
![]() |
Sanyo Denki | P3, 800MHZ, FC-PGA |
5,000
In-stock
|
|||
![]() |
Seeed | ICE TOWER CPU COO... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 23MM... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
![]() |
Sanyo Denki | P4,775-LAND LGA |
5,000
In-stock
|
|||
![]() |
TE Connectivity | 25MM HEATSINK ASS... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 35X35X14.5M... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 35MMX35MM... |
10
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 35... |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|