- Manufacturer:
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- CUI Devices (1)
- Series:
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- Part Status:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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3 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEATSINK HALF BR... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 57.5 X 57.5... |
96
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 57.5 X 57.5... |
4
In-stock
|