- Manufacturer：
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- Aavid (79)
- ABB Embedded Power (15)
- Assmann WSW Components (154)
- CUI Devices (2)
- DFRobot (3)
- Seeed (10)
- Sunon (5)
- t-Global Technology (13)
- TE Connectivity (13)
- Wakefield-Vette (130)
- Part Status：
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- Packaging：
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- Shape：
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- Thermal Resistance @ Natural：
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910 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Electronic Components | THERMAL LINK PRE... |
5,000
In-stock
|
|||
|
|
Delta Electronics | HEATSINK ASSY IN... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | THERMAL LINK PRE... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK PRESS O... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | THERMAL LINK PRE... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | TRANS THERMAL LI... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | THERMAL LINK PRE... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | THERMAL LINK PRE... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 23MM... |
5,000
In-stock
|
|||
|
|
Molex Corporation | CHIPSET COOLER C... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
Aavid | HEATSINK |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X24.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X2... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
20
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X24.5M... |
5,000
In-stock
|