- Manufacturer:
-
- Aavid (25)
- DFRobot (1)
- Panasonic (1)
- Sanyo Denki (2)
- Seeed (11)
- TE Connectivity (11)
- Trenz Electronic (5)
- Series:
-
- Part Status:
-
- Material:
-
- Shape:
-
- Diameter:
-
- Package Cooled:
-
- Attachment Method:
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- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
92 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions, Inc. | CUSTOM MAXIFLOW ... |
5
In-stock
|
|||
![]() |
Trenz Electronic | HEATSINK FOR TE06... |
5,000
In-stock
|
|||
![]() |
Seeed | ICE TOWER CPU COO... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | TRANS THERMAL LI... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
![]() |
Delta Electronics | FAN CPU COOLER 100... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 23MM... |
5,000
In-stock
|
|||
![]() |
Molex Corporation | CHIPSET COOLER C... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
![]() |
Aavid | HEATSINK |
5,000
In-stock
|
|||
![]() |
Panasonic | HEAT SINK |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK APC 723 |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK APC 723 |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK APC 723 |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK CUSTOM |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK APC 724 |
5,000
In-stock
|
|||
![]() |
CTS Electronic Components | HEATSINK CUSTOM ... |
5,000
In-stock
|