- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK FOR BGA... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
485
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
2,013
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 27.9M... |
950
In-stock
|