- Manufacturer:
-
- Comair Rotron (3)
- CUI Devices (2)
- Ohmite (4)
- Part Status:
-
- Material:
-
- Length:
-
- Width:
-
- Package Cooled:
-
- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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15 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
![]() |
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
![]() |
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
![]() |
Apex Microtechnology | HEATSINK 12P PWR S... |
22
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
256
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 46... |
728
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 46... |
80
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
48
In-stock
|
|||
![]() |
Ohmite | HEATSINK DUAL FO... |
23
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
194
In-stock
|
|||
![]() |
Ohmite | HEATSINK AND CLI... |
1,341
In-stock
|
|||
![]() |
Ohmite | HEATSINK W/CLIP F... |
557
In-stock
|
|||
![]() |
Ohmite | HEATSINK AND CLI... |
994
In-stock
|