- Manufacturer：
-
- Comair Rotron (3)
- CUI Devices (2)
- Ohmite (8)
- Part Status：
-
- Material：
-
- Length：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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14 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
256
In-stock
|
|||
|
|
Ohmite | HEATSINK DUAL FO... |
51
In-stock
|
|||
|
|
Ohmite | HEATSINK DUAL FO... |
23
In-stock
|
|||
|
|
Ohmite | HEATSINK W/CLIP F... |
551
In-stock
|
|||
|
|
Ohmite | HEATSINK AND CLI... |
128
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
194
In-stock
|
|||
|
|
Ohmite | HEATSINK AND CLI... |
1,341
In-stock
|
|||
|
|
Ohmite | HEATSINK W/CLIP F... |
557
In-stock
|
|||
|
|
Ohmite | HEATSINK AND CLI... |
21,015
In-stock
|
|||
|
|
Ohmite | HEATSINK AND CLI... |
994
In-stock
|