- Manufacturer：
-
- Aavid (7)
- Comair Rotron (1)
- CUI Devices (4)
- Ohmite (2)
- Wakefield-Vette (2)
- Part Status：
-
- Material：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
20 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 12... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
|||
|
|
Apex Microtechnology | HEATSINK WAKEFIE... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK PWR W/PI... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
86
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 SO... |
1,120
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
4,735
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
54
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
791
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 PO... |
2,485
In-stock
|
|||
|
|
Aavid | HEATSINK TO-218/TO... |
5,426
In-stock
|