- Manufacturer:
-
- CUI Devices (1)
- Wakefield-Vette (1)
- Part Status:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
4 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEATSINK HALF BR... |
5,000
In-stock
|
|||
![]() |
ABB Embedded Power | HEATSINK 2.27L X.45"... |
5,000
In-stock
|
|||
![]() |
ABB Embedded Power | HEATSINK 2.39L X.45"... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK DC/DC HA... |
2,118
In-stock
|