- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK FOR BGA... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK FOR BGA... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK CPU 35MM... |
920
In-stock
|