- Manufacturer:
-
- Aavid (4)
- Comair Rotron (1)
- CUI Devices (3)
- Part Status:
-
- Packaging:
-
- Type:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
9 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
|||
![]() |
Aavid | TOP MOUNT HEATSI... |
622
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK TO-263 19.3... |
393
In-stock
|
|||
![]() |
Aavid | HEATSINK TO-220 |
4,032
In-stock
|
|||
![]() |
Aavid | HEATSINK TO-220 |
4,032
In-stock
|
|||
![]() |
Aavid | HEATSINK TO-220 |
4,000
In-stock
|