- Manufacturer：
-
- Comair Rotron (1)
- TE Connectivity (1)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 20... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEATSINK ASSEMBL... |
25
In-stock
|