- Manufacturer：
-
- CUI Devices (3)
- Trenz Electronic (1)
- Series：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Trenz Electronic | HEATSPREADER FOR... |
5
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
51
In-stock
|