- Manufacturer：
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- CUI Devices (2)
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
999
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
198
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
525
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
2,517
In-stock
|