- Manufacturer：
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- CUI Devices (5)
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
9
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
2,973
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
864
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
964
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.6W... |
327
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
696
In-stock
|