- Manufacturer：
-
- Comair Rotron (2)
- CUI Devices (19)
- Ohmite (7)
- Part Status：
-
- Material：
-
- Length：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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38 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
5
In-stock
|
|||
|
|
Ohmite | HEATSINK TO-218,TO... |
725
In-stock
|