Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSS-B20-NP-03 CUI Devices
HEATSINK TO-220 3.6W...
5,000
In-stock
HS01 Apex Microtechnology
HEATSINK TOP MT T...
1,149
In-stock
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