- Manufacturer：
-
- Comair Rotron (2)
- Wakefield-Vette (1)
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 24... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 24... |
5,000
In-stock
|
|||
|
|
ABB Embedded Power | HEATSINK 2.27L X.95"... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
5,000
In-stock
|