- Manufacturer：
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- CUI Devices (1)
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK HALF BR... |
5,000
In-stock
|
|||
|
|
ABB Embedded Power | HEATSINK 2.36L X.94"... |
5,000
In-stock
|
|||
|
|
ABB Embedded Power | HEATSINK 4.56L X.94"... |
5,000
In-stock
|
|||
|
|
ABB Embedded Power | HEATSINK 2.28L X.84"... |
5,000
In-stock
|