- Manufacturer：
-
- CUI Devices (3)
- Material：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
14
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1,436
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,352
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM WI... |
1,359
In-stock
|
|||
|
|
Assmann WSW Components | HEAT SINK ANOD AL... |
2,146
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
293
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,442
In-stock
|