- Manufacturer：
-
- Aavid (27)
- Comair Rotron (3)
- CUI Devices (1)
- TE Connectivity (11)
- Wakefield-Vette (3)
- Series：
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- Part Status：
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- Type：
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- Shape：
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- Length：
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- Width：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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85 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 23MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | 25MM HEATSINK ASS... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 35X35X14.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 35MMX35MM... |
10
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 35... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 20... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|