- Manufacturer：
-
- Sanyo Denki (2)
- Seeed (1)
- TE Connectivity (11)
- Series：
-
- Part Status：
-
- Material：
-
- Type：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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17 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Seeed | ICE TOWER CPU COO... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 23MM... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
Sanyo Denki | P4,775-LAND LGA |
5,000
In-stock
|
|||
|
|
TE Connectivity | 25MM HEATSINK ASS... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK CLIP ON... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | CLIP W/LOCK FOR H... |
5,000
In-stock
|
|||
|
|
Sanyo Denki | P4,775-LAND LGA |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 25MM... |
250
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 25MM... |
279
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
8
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
22
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK CLIP ON... |
747
In-stock
|