- Manufacturer：
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- CUI Devices (4)
- Part Status：
-
- Material：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
88
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TIN SOL... |
75
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
2,973
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1,188
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
864
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
964
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 VE... |
860
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
696
In-stock
|