- Manufacturer：
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- CUI Devices (3)
- Material：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
256
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
2,438
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
51
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
905
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
902
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
198
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
525
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1,153
In-stock
|