- Manufacturer:
-
- TE Connectivity (1)
- Wakefield-Vette (2)
- Series:
-
- Material:
-
- Type:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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4 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK ALUM BL... |
5,000
In-stock
|
|||
![]() |
TE Connectivity | HEATSINK CFP RID... |
262
In-stock
|
|||
![]() |
Apex Microtechnology | HEATSINK SMT |
86
In-stock
|