- Manufacturer:
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- Wakefield-Vette (4)
- Part Status:
-
- Material:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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30 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Wakefield-Vette | HEATSINK CPU 25MM... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X19.5M... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X14.5M... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X9.5M... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK CPU 25MM... |
5,000
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X24.5M... |
5
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK CPU 25MM... |
524
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1,906
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1,917
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1,918
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1,908
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1,827
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1,883
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1,735
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
14
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
2
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
5
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
5,000
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
1,436
In-stock
|