Series:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSS-B20-NP-01 CUI Devices
HEATSINK TO-220 4.1W...
5,000
In-stock
ATS-PCBT1075 Advanced Thermal Solutions, Inc.
HEATSINK TO-126 BL...
453
In-stock
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