- Manufacturer：
-
- Comair Rotron (2)
- CUI Devices (5)
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
154
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
2,725
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CL... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
874
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
994
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
146
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
315
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220 19X... |
12,316
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-220 15X... |
2,411
In-stock
|