- Material:
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- Packaging:
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- Length:
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- Width:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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18 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEATSINK TO-220 4W ... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 3.9W... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 4.4W... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 4.1W... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 2.9W... |
358
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 6.5W... |
1,294
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 4.1W... |
442
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 2.9W... |
874
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 2.3W... |
994
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 2.9W... |
146
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 4W ... |
315
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 4.2W... |
734
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 4.2W... |
884
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 6.8W... |
2,706
In-stock
|