Series:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
Image Part Manufacturer Description Stock Action
HSE-B20350-NP CUI Devices
HEAT SINK, EXTRUS...
5,000
In-stock
ATS-EXL69-300-R0 Advanced Thermal Solutions, Inc.
HEATSINK AL6063 300X...
15
In-stock
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