- Manufacturer：
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- Aavid (4)
- CUI Devices (1)
- Material：
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- Shape：
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- Diameter：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
692
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
3,915
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1,472
In-stock
|
|||
|
|
Aavid | HEATSINK TO-3 BLA... |
4,709
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
828
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 TA... |
7,895
In-stock
|
|||
|
|
Aavid | HEATSINK COPPER ... |
2,343
In-stock
|