- Material：
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- Type：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield-Vette | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 BO... |
845
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK DPAK SM... |
14,343
In-stock
|