- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.6W... |
582
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
2,250
In-stock
|