- Manufacturer：
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- CUI Devices (2)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
|||
|
|
t-Global Technology | XL25 CERAMIC 10X10M... |
4
In-stock
|
|||
|
|
t-Global Technology | XL25 CERAMIC 10X10M... |
5,000
In-stock
|
|||
|
|
t-Global Technology | XL25 CERAMIC BOAR... |
5,102
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ANOD AL... |
18,335
In-stock
|