- Manufacturer:
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- CUI Devices (1)
- Material:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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3 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
|||
![]() |
t-Global Technology | HEATSINK CER 20X20... |
1,384
In-stock
|
|||
![]() |
t-Global Technology | XL25 CERAMIC BOAR... |
3,304
In-stock
|