- Manufacturer：
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- CUI Devices (1)
- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.4W... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-126 13.2... |
4,080
In-stock
|