- Manufacturer：
-
- Aavid (49)
- DFRobot (1)
- Panasonic (1)
- Sanyo Denki (2)
- Seeed (12)
- TE Connectivity (11)
- Trenz Electronic (5)
- Wakefield-Vette (1)
- Series：
-
- Part Status：
-
- Material：
-
- Type：
-
- Shape：
-
- Diameter：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Filter：
122 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Molex Corporation | CHIPSET COOLER #2... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
OSEPP Electronics Limited | RASPBERRY PI COP... |
200
In-stock
|
|||
|
|
Seeed | HEATSINK FOR ROC... |
49
In-stock
|
|||
|
|
Seeed | HEAT SINK KIT FOR... |
31
In-stock
|
|||
|
|
Trenz Electronic | HEATSINK FOR TE07... |
28
In-stock
|
|||
|
|
DFRobot | RASPBERRY PI HEA... |
29
In-stock
|
|||
|
|
OSEPP Electronics Limited | RASPBERRY PI TAL... |
200
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 25MM... |
250
In-stock
|
|||
|
|
Aavid | TO-5 PUSH-ON HEATS... |
1,931
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 25MM... |
279
In-stock
|
|||
|
|
Seeed | RASPERRY PI COPP... |
199
In-stock
|
|||
|
|
OSEPP Electronics Limited | RASPBERRY PI LOW... |
200
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
8
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
22
In-stock
|
|||
|
|
Trenz Electronic | HEATSINK FOR TE07... |
2
In-stock
|
|||
|
|
Delta Electronics | FAN CPU COOLER 90X... |
5,000
In-stock
|
|||
|
|
Trenz Electronic | HEATSINK FOR TE07... |
136
In-stock
|
|||
|
|
Aavid | HEATSINK TO-5 2W B... |
933
In-stock
|
|||
|
|
Aavid | HEATSINK TO-5 1W H... |
1,133
In-stock
|