- Part Status：
-
- Packaging：
-
- Type：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ABB Embedded Power | HEATSINK 2.28L X.44"... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Aavid | TOP MOUNT HEATSI... |
5,434
In-stock
|
|||
|
|
Aavid | HEATSINK D2PAK .4"... |
8,600
In-stock
|
|||
|
|
Aavid | HEATSINK D2PAK .4"... |
8,600
In-stock
|
|||
|
|
Aavid | HEATSINK D2PAK .4"... |
8,500
In-stock
|