Series:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSE-B508-045H CUI Devices
HEAT SINK, EXTRUS...
5,000
In-stock
V7466Y Assmann WSW Components
HEATSINK ALUM AN...
791
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