- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (25)
- Series：
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- Length：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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77 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Electronic Components | HEATSINK LOW-PRO... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X17.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X12.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X24.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X24.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X14.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X19.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X7.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X9.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X9.5M... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
50
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
82
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
30
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
173
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
188
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
148
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
524
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
358
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
439
In-stock
|